Floform Case Studies
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Case Studies

As we complete new projects we will add them to this case studies section. To view any of the existing case studies, click on the links below.

 

   
 

   


Integral Flange Flatbase for Semiconductor – F2581
Description
A 73mm dia. by 15mm thick copper disc or base, with a thin annular copper flange 110mm outside dia. by 73mm internal dia, by 0.13mm thick brazed to it concentrically. The component forms the lower part of a power semiconductor assembly, which is a hermetically sealed enclosure.

 
   

Challenge
To reduce cost and improve product reliability. With the original construction method it was possible to get leakage in the joint between the base and the flange. This was difficult to detect during component manufacture, and only showed up when the fully built semiconductor device was tested, after a lot of value had been added. The losses experienced by the semiconductor manufacturer were as high as 15% with a two-piece design.

Floform’s Response
Floform developed a one-piece cold formed part, with the flange formed integrally with the base from a single slug of copper. Only minor machining operations were necessary to finish the detailed features on the base.

   

Benefits

Product reliability: Significantly improved. Failure from leakage between the base and the flange was totally eliminated by the one-piece design.

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